Thousands of printed circuit boards are assembled at Hi-Tek every month. This includes through-hole technology, surface mount technology, and mixed boards. All work is performed in an ESD-protected environment. Assemblies are built to IPC standards using precision equipment.

Services offered by Hi-Tek Electronics include:

  • Component procurement and stocking
  • Automated surface mount assembly
  • Surface mount and mixed technology prototype assembly
  • Through-hole assembly
  • BGA inspection and rework
  • Conformal coating
  • Wire and cable preparation
  • Mechanical assembly
  • Functional Testing

Surface Mount Assembly

Our surface mount department is equipped with state-of-the-art equipment and staffed with trained and qualified professionals. High-speed placement machines with quick changeover capabilities make any job cost-effective. In addition, skilled prototype assembly technicians can hand-build one-of-a-kind prototypes to your specifications.

Our surface mount assembly process includes-

  • Paste or glue screen printing
  • Automated component placement
  • Pre-flow visual inspection
  • Convection reflow soldering
  • Automatic Optical Inspection (AOI)
  • Manual assembly and hand-adds
  • Visual inspection (as necessary)
  • Aqueous washing
  • ESD packaging and shipping

We handle a variety of components such as-

  • 0201, 0402, 0603, 0805, 1206 chip packages
  • Small Outline ICs (SOIC)
  • Thin Small Outline Package (TSOP)
  • Quad Flat Pack (QFP) ICs
  • Plastic Leaded Chip Carrier (PLCC)
  • Ball Grid Array (BGA)
  • Various metric components and sockets

And we use specialized equipment for these assemblies-

  • Solder paste stencil machines (MPM and Juki)
  • High-speed automated pick-and-place machines (MyData and Juki)
  • Precise convection reflow ovens (Heller and BTU)
  • AOI machines (YesTech and Koh Young)
  • X-Ray system with advanced capture and analysis software
  • 7.5x-40x stereo microscopes and magnifiers
  • BGA rework station (ERSA)

Through-Hole Assembly

Hi-Tek still assembles boards with through-hole parts. In larger quantities or single-sided boards the boards will be sent computer-controlled wave solder machines with precise profiles. Quick flux changeover allows us to use either water-soluble organic or no-clean RMA flux and we have both a lead and leadfree (RoHS) machine. After rigorous inspection, soldered circuit boards are washed with deionized water using a highly efficient aqueous washing system. Certain parts that cannot be handled through the semi-automated process can be manually soldered.


The through-hole assembly process includes—

  • Component preparation
  • Component insertion
  • Pre-flow visual inspection
  • Solder flow
  • Secondary assembly
  • Visual component and solder joint inspection
  • Mechanical assembly
  • Final inspection
  • ESD packaging and shipping

The following equipment is available for these kinds of boards:

  • A full array of prep equipment
  • Wave solder machines (Electrovert and Technical Devices)
  • ESD certified and calibrated soldering stations
  • ESD-protected and calibrated mechanical assembly tools